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TE Connectivity AMP Connectors 104550-6 — Pin Headers, Sockets & Housings

104550-6 TE Connectivity AMPMODU System 50 Receptacle

MPN104550-6
Active

TE Connectivity AMPMODU System 50 receptacle, order code 104550-6, 50 positions, dual row, 1.27 mm pitch, 30 VAC, gold-plated mating contacts, surface-mount, solder termination, board lock.

$9.5191Ref. price · indicative, final on quote
Source DocumentedChannel stated on listing & quote
Condition PhotosReal unit photos / video on request
WhatsApp AnswersFast human replies for stock & sourcing questions
Worldwide DispatchDHL/FedEx — transit quoted per order
Independent China distributor & sourcing agent· Listing updated Aug 2026

Specifications

104550-6 key specifications
ParameterValue
SeriesAMPMODU System 50
TypeFemale Socket
MountingSurface Mount
Connector typeReceptacle
Fastening typePush-Pull
Voltage rating30VAC
Operating temperature-65°C ~ 105°C
Contact materialPhosphor Bronze
Insulation colorBlack
Insulation height0.370\" (9.40mm)
Insulation materialPolyphthalamide (PPA)
Mated stacking heights11.94mm, 13.08mm

All specifications

104550-6 additional specifications
ParameterValue
Material flammability ratingUL94 V-0
StyleBoard to Board
PackageTube
FeaturesBoard Lock
TerminationSolder
Contact shapeSquare
Rows2
Pitch0.050\" (1.27mm)
Positions50
Row spacing - mating0.100\" (2.54mm)
Contact finish - postTin-Lead
Contact finish - matingGold
Contact finish thickness - post150.0µin (3.81µm)
Contact finish thickness - mating30.0µin (0.76µm)

Product details

Board-to-board receptacle, 50 positions, 1.27 mm pitch

The 104550-6 is the 50-position dual-row member of the TE Connectivity AMPMODU System 50 receptacle line, a board-to-board connector with a 1.27 mm mating pitch. Gold-plated mating contacts rated 30 VAC, surface-mount solder termination, and an integral board lock for reflow retention.

Stack height and row spacing

The row spacing is 2.54 mm, and the mated stack heights are 11.94 mm or 13.08 mm, accommodating two board-to-board z-height budgets from the same footprint.