40-Position, 1.27 mm Pitch — Board Fit and Stack Height
The 104652-4: The footprint matches the AMPMODU 50/50 Grid header family, so the board layout is set by the 1.27 mm grid. Mated stack heights are 6.35 mm, 8.13 mm, and 9.91 mm, which gives three board-to-board spacing options in a mezzanine or parallel-board stack. The 0.187" (4.75 mm) insulation height keeps the contact area clear of the board surface.
RoHS non-compliant due to tin-lead plating on the solder posts (150.0 µinch / 3.81 µm). If your BOM requires full RoHS compliance, check the tin-plated variants in the AMPMODU 50/50 Grid series.
