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TE Connectivity AMP Connectors 104693-3 — Pin Headers, Sockets & Housings

104693-3 TE Connectivity AMPMODU 50/50 Grid Header, 30 Pos

MPN104693-3
Active

TE Connectivity AMP Connectors AMPMODU 50/50 Grid, Board to Board Header, 30 Positions, 0.050" (1.27mm) Pitch, Dual Row, Surface Mount, Gold Mating Contacts, Board Lock, UL94 V-0

$5.6221Ref. price · indicative, final on quote
TE Connectivity AMP Connectors 104693-3 datasheet (PDF)
Source DocumentedChannel stated on listing & quote
Condition PhotosReal unit photos / video on request
WhatsApp AnswersFast human replies for stock & sourcing questions
Worldwide DispatchDHL/FedEx — transit quoted per order
Independent China distributor & sourcing agent· Listing updated Aug 2026

Specifications

104693-3 key specifications
ParameterValue
SeriesAMPMODU 50/50 Grid
TypeMale Pin
MountingSurface Mount
Connector typeHeader
Fastening typePush-Pull
Current rating0.5A per Contact
Operating temperature-65°C ~ 105°C
Contact materialPhosphor Bronze
Insulation colorBlack
Insulation height0.367\" (9.33mm)
Insulation materialLiquid Crystal Polymer (LCP)
Mated stacking heights9.91mm

All specifications

104693-3 additional specifications
ParameterValue
Material flammability ratingUL94 V-0
StyleBoard to Board
PackageTube
FeaturesBoard Lock
ShroudingShrouded - 4 Wall
TerminationSolder
ApplicationsAutomotive, General Purpose, Medical, Military, Telecommunications
Contact shapeCircular
Rows2
Pitch0.050\" (1.27mm)
Positions30
Row spacing - mating0.050\" (1.27mm)
Contact finish - postTin-Lead
Contact finish - matingGold
Contact length - mating0.120\" (3.05mm)
Contact finish thickness - post150.0µin (3.81µm)
Contact finish thickness - mating30.0µin (0.76µm)

Product details

The 0.050" (1.27mm) pitch on both rows sets the PCB footprint density — at 30 circuits, the connector occupies roughly 0.75" along the board edge. Each contact is rated 0.5A, typical for signal-level interconnects in this pitch class.

Mounting and Retention for SMT Assembly

This header is surface-mount terminated with solder tails and includes board locks that anchor the component during reflow.

Material Ratings and Operating Range

The tin-lead on the solder tails is compatible with standard SnPb reflow profiles; lead-free assembly may require a different post-plating variant if the buyer's process is RoHS-only.

Frequently asked questions

Is 104693-3 RoHS compliant?

The contact finish on the post is tin-lead, which may not meet RoHS compliance for lead-free applications. Confirm the specific RoHS status with the supplier at time of order.