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TE Connectivity AMP Connectors 104693-5 — Pin Headers

104693-5 TE Connectivity AMP Connectors Pin Header SMD

MPN104693-5
Active

TE Connectivity AMP Connectors AMPMODU 50/50 Grid, Board to Board Header, SMD, 50 positions, 2 rows, 0.050" (1.27mm) pitch, shrouded - 4 wall, board lock, gold mating contact, 0.5A per contact, -65°C ~ 105°C, UL94 V-0.

$11.6400Ref. price · indicative, final on quote
RoHSRoHS non-compliant
SeriesAMPMODU 50/50 Grid
Sourced new & surplus through independent channelsAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

104693-5 key specifications
ParameterValue
SeriesAMPMODU 50/50 Grid
TypeMale Pin
MountingSurface Mount
Connector typeHeader
Fastening typePush-Pull
Current rating0.5A per Contact
Operating temperature-65°C ~ 105°C
Contact materialPhosphor Bronze
Insulation colorBlack
Insulation height0.367\" (9.33mm)
Insulation materialLiquid Crystal Polymer (LCP)
Mated stacking heights9.91mm

All specifications

104693-5 additional specifications
ParameterValue
Material flammability ratingUL94 V-0
StyleBoard to Board
PackageTube
FeaturesBoard Lock
ShroudingShrouded - 4 Wall
TerminationSolder
ApplicationsAutomotive, General Purpose, Medical, Military, Telecommunications
Contact shapeCircular
Rows2
Pitch0.050\" (1.27mm)
Positions50
Row spacing - mating0.050\" (1.27mm)
Contact finish - postTin-Lead
Contact finish - matingGold
Contact length - mating0.120\" (3.05mm)
Contact finish thickness - post150.0µin (3.81µm)
Contact finish thickness - mating30.0µin (0.76µm)

Product details

What this 50-position SMT header is built for

The 104693-5 is a 50-position, dual-row surface-mount header from the AMPMODU 50/50 Grid series, designed for board-to-board stacking at a mated height of 9.91 mm. A board lock on the SMT package holds the header in place through reflow and resists shear forces from the mating cable assembly — useful in applications where the board sees vibration after assembly.

Footprint and routing constraints

At 50 positions across two rows spaced 0.050" apart, the header occupies a 1.27 mm × 1.27 mm grid.

Termination is solder to surface-mount pads. The board lock provides mechanical retention during reflow — no secondary adhesive or through-hole anchor needed. Mates with a matching AMPMODU 50/50 Grid receptacle (not included) at a stacking height of 9.91 mm.

Frequently asked questions

What is the pitch of the 104693-5?

The mating pitch is 0.050" (1.27 mm) on both rows, with the same row-to-row spacing.

Is the 104693-5 RoHS compliant?

No — the post contact finish is tin-lead, making this part RoHS non-compliant. Verify your assembly's RoHS exemption before ordering.

What is the mounting style of the 104693-5?

Surface-mount (SMD) with a board lock for reflow retention. No through-hole posts.