TE Connectivity AMPMODU 50/50 Grid header, order code 104894-8, 80 positions, dual row, 1.27 mm pitch, 0.5 A per contact, gold-plated mating contacts, surface-mount right-angle, solder termination.
| Parameter | Value |
|---|---|
| Series | AMPMODU 50/50 Grid |
| Type | Male Pin |
| Mounting | Surface Mount, Right Angle |
| Connector type | Header |
| Fastening type | Push-Pull |
| Current rating | 0.5A per Contact |
| Operating temperature | -65°C~105°C |
| Contact material | Brass |
| Insulation color | Black |
| Insulation height | 0.213\" (5.40mm) |
| Insulation material | Liquid Crystal Polymer (LCP) |
| Material flammability rating | UL94 V-0 |
| Parameter | Value |
|---|---|
| Style | Board to Board |
| Package | Tube |
| Features | Board Lock, Solder Retention |
| Shrouding | Shrouded - 4 Wall |
| Termination | Solder |
| Applications | Automotive, General Purpose, Medical, Military, Telecommunications |
| Contact shape | Circular |
| Rows | 2 |
| Pitch | 0.050\" (1.27mm) |
| Positions | 80 |
| Row spacing - mating | 0.050\" (1.27mm) |
| Contact finish - post | Tin-Lead |
| Contact finish - mating | Gold |
| Contact finish thickness - post | 150.0µin (3.81µm) |
| Contact finish thickness - mating | 30.0µin (0.76µm) |
The 104894-8 is the 80-position member of TE Connectivity's AMPMODU 50/50 Grid header line, a board-to-board shrouded header with a 1.27 mm pitch.
The dual-row layout with 1.27 mm pitch and row spacing occupies a compact board footprint; the 0.213" (5.40 mm) insulation height and shrouded 4-wall housing protect contacts during mating.