TE Connectivity AMPMODU 50/50 Grid header, 104895-8, 80-position dual-row, 0.050" (1.27 mm) pitch, surface-mount right-angle, shrouded 4-wall, gold-plated contacts, board lock, UL94 V-0.
| Parameter | Value |
|---|---|
| Series | AMPMODU 50/50 Grid |
| Type | Male Pin |
| Mounting | Surface Mount, Right Angle |
| Connector type | Header |
| Fastening type | Latch Holder |
| Current rating | 0.5A per Contact |
| Operating temperature | -65°C ~ 105°C |
| Contact material | Brass |
| Insulation color | Black |
| Insulation height | 0.213\" (5.40mm) |
| Insulation material | Liquid Crystal Polymer (LCP) |
| Material flammability rating | UL94 V-0 |
| Parameter | Value |
|---|---|
| Style | Board to Board |
| Package | Tube |
| Features | Board Lock, Solder Retention |
| Shrouding | Shrouded - 4 Wall |
| Termination | Solder |
| Applications | Automotive, General Purpose, Medical, Military, Telecommunications |
| Contact shape | Circular |
| Rows | 2 |
| Pitch | 0.050\" (1.27mm) |
| Positions | 80 |
| Row spacing - mating | 0.050\" (1.27mm) |
| Contact finish - post | Tin-Lead |
| Contact finish - mating | Gold |
| Contact finish thickness - post | 150.0µin (3.81µm) |
| Contact finish thickness - mating | 30.0µin (0.76µm) |
Each contact is rated 0.5 A — this is a signal-density connector, not a power rail.
The dual-row layout with 0.050" row spacing and 0.050" pitch means the PCB footprint is dense — 80 circuits in a 2 × 40 grid. Confirm the receptacle pitch and position count match before committing the BOM line.
The mating pitch is 0.050" (1.27 mm), with the same spacing between rows. This is the footprint dimension for the PCB layout.
The insulation height above the board is 0.213" (5.40 mm). The total mated stack height depends on the mating receptacle — confirm with the receptacle datasheet.