TE Connectivity AMP Connectors AMPMODU Mod II unshrouded breakaway header, 8 circuits, single row, 0.100" (2.54 mm) pitch, surface-mount solder termination, gold or gold-palladium mating finish, pick-and-place compatible, RoHS compliant.
| Parameter | Value |
|---|---|
| Series | AMPMODU Mod II |
| Type | Male Pin |
| Mounting | Surface Mount |
| Connector type | Header, Breakaway |
| Fastening type | Push-Pull |
| Contact material | Brass |
| Insulation color | Black |
| Insulation height | 0.110\" (2.79mm) |
| Insulation material | Polycyclohexylenedimethylene Terephthalate (PCT) |
| Style | Board to Board or Cable |
| Package | Bulk |
| Features | Pick and Place |
| Parameter | Value |
|---|---|
| Shrouding | Unshrouded |
| Termination | Solder |
| Contact shape | Square |
| Rows | 1 |
| Pitch | 0.100\" (2.54mm) |
| Positions | 8 |
| Contact finish - post | Tin |
| Contact finish - mating | Gold or Gold-Palladium |
| Contact length - mating | 0.228\" (5.80mm) |
| Contact finish thickness - post | 118.1µin (3.00µm) |
| Contact finish thickness - mating | Flash |
At 8 circuits in a single row, this header is a compact signal interconnect for low-density I/O. The mating contact finish is gold or gold-palladium (flash), while the post finish is tin (3.00 µm). Gold on the mating side provides corrosion resistance for moderate cycle counts; the tin tail is compatible with lead-free solder processes.
Yes, it is listed with a Pick and Place feature, meaning it includes a vacuum pick-up area or flat surface for automated SMT placement.