Board-to-board stacking with 0.100-inch pitch
The 1241152-3: It accepts square pins from mating headers and supports both bottom and top entry, giving flexibility in mezzanine or parallel-board layouts. The gold mating finish at 31.5 µinch (0.80 µm) thickness means this contact can handle repeated mate/unmate cycles without the gold wearing through to the base copper — a practical edge for test points or modules that get swapped in the field.
Pick-and-place ready, surface-mount termination
Supplied on tape and reel (cut tape available), with a pick-and-place feature for automated assembly. The LCP housing withstands reflow temperatures without distortion.