Board-to-board receptacle for 0.100-inch pitch layouts
The 1241152-4: The gold mating finish (31.5 µin) handles repeated connect/disconnect cycles without oxidation, while the tin-plated posts (100 µin) solder cleanly to the PCB.

TE Connectivity AMPMODU HV-100, 1241152-4, board-to-board receptacle, 4 positions, 0.100" (2.54 mm) pitch, gold mating finish, SMT, Pick and Place compatible.
| Parameter | Value |
|---|---|
| Series | AMPMODU HV-100 |
| Type | Female Socket |
| Mounting | Surface Mount |
| Connector type | Receptacle, Bottom or Top Entry |
| Fastening type | Push-Pull |
| Contact material | Copper Alloy |
| Insulation color | Black |
| Insulation height | 0.244\" (6.20mm) |
| Insulation material | Liquid Crystal Polymer (LCP) |
| Style | Board to Board |
| Package | Tape & Reel (TR) Cut Tape (CT) |
| Features | Pick and Place |
| Parameter | Value |
|---|---|
| Termination | Solder |
| Contact shape | Square |
| Rows | 1 |
| Pitch | 0.100\" (2.54mm) |
| Positions | 4 |
| Contact finish - post | Tin |
| Contact finish - mating | Gold |
| Contact finish thickness - post | 100.0µin (2.54µm) |
| Contact finish thickness - mating | 31.5µin (0.80µm) |
The 1241152-4: The gold mating finish (31.5 µin) handles repeated connect/disconnect cycles without oxidation, while the tin-plated posts (100 µin) solder cleanly to the PCB.
The mating pitch is 0.100" (2.54 mm).
Yes — the connector is listed with the Pick and Place feature, making it suitable for automated SMT placement.