1586520-2 MATE-N-LOK Header, 12 Position, 5.08 mm, 12 A
TE Connectivity 1586520-2, Commercial MATE-N-LOK series, 12-circuit dual-row shrouded header, 0.200-inch (5.08 mm) pitch, through-hole solder termination, detent lock, gold-plated mating contacts 30.0 µin over tin solder tails, rated 12 A per circuit, 250 VAC, operating -55 to 105 °C, UL94 V-2.
Specifications
| Parameter | Value |
|---|---|
| Series | Commercial MATE-N-LOK |
| Type | Male Pin |
| Mounting | Through Hole |
| Connector type | Header |
| Fastening type | Detent Lock |
| Voltage rating | 250VAC |
| Current rating | 12A |
| Operating temperature | -55°C ~ 105°C |
| Contact material | Copper Alloy |
| Insulation color | Natural |
| Insulation height | 0.375\" (9.53mm) |
| Insulation material | Polyamide (PA), Nylon |
All specifications
| Parameter | Value |
|---|---|
| Material flammability rating | UL94 V-2 |
| Style | Board to Cable/Wire |
| Package | Bulk |
| Shrouding | Shrouded - 4 Wall |
| Termination | Solder |
| Applications | General Purpose |
| Contact shape | Circular |
| Rows | 2 |
| Pitch | 0.200\" (5.08mm) |
| Positions | 12 |
| Row spacing - mating | 0.360\" (9.14mm) |
| Contact finish - post | Tin |
| Contact length - post | 0.150\" (3.81mm) |
| Contact finish - mating | Gold |
| Contact length - mating | 0.181\" (4.60mm) |
| Contact finish thickness - mating | 30.0µin (0.76µm) |
Frequently asked questions
What connector series does the 1586520-2 belong to?
Commercial MATE-N-LOK, Style Board to Cable/Wire, connector type Header.
What is the 1586520-2's current and voltage rating?
12 A per contact at 250 VAC, across all 12 loaded positions in a dual-row layout.
What plating does the 1586520-2 use, and why does it matter?
Gold at 30.0 µin (0.76 µm) on the mating interface; tin on the through-hole solder tails. The gold thickness is meaningful — 30 µin is not flash plating, so the interface will survive substantially more mating cycles than a thin-gold or tin-on-both-side header before contact resistance degrades. The tin tails give reliable solder joint formation without the cost premium of gold across the whole contact.