1.00 mm pitch vertical FFC/FPC connector for signal-level board interconnects
The 0.30 mm FFC thickness acceptance matches standard 0.3 mm flat flex cables. Tin-plated contacts on phosphor bronze base metal keep cost down for applications with moderate mating-cycle requirements — tin is adequate for occasional reconnects in non-corrosive indoor environments.
Surface-mount footprint and routing density
The SMT pads are reflow-soldered; no plated through-holes are needed, which frees up routing channels on inner layers directly under the connector. The 5.59 mm height above board gives clearance for passive components or traces routed under the connector body on the top layer.