2.00mm Pitch, 9-Position Header for Wire-to-Board
The 1735446-9: This is a single-row, 9-position header from TE's High Performance Interconnect (HPI) series.
Termination Options: Press-Fit or Solder
Press-fit eliminates the reflow step for backplane-style assembly; solder gives a conventional through-hole joint. Mating contact finish is tin, rated for moderate mating cycles.
RoHS3 compliant per directive 2015/863.
