200-Position DDR2 SODIMM with 25° Angle
The TE Connectivity AMP 1746540-4 is a 200-position DDR2 SODIMM connector designed for surface-mount attachment. It accepts a standard DDR2 memory module at a 25° angle, which keeps the module low over the board — the mated height is 0.196" (4.00mm). This angled, low-profile geometry is a common fit in blade servers, thin clients, and embedded systems where the DIMM slot must sit under a drive bay or secondary board. The contact finish is gold flash — a thin gold layer over nickel that provides reliable signal contact for the typical 50–100 mating cycles a SODIMM sees in its service life. The flash grade keeps the per-unit cost down compared to thicker gold, and for a module that seats once and stays, it is the correct economic choice. The housing includes a board guide and latches — the latches hold the memory module in place against vibration, and the board guide aligns the module during insertion so the contacts don't stub against the housing wall.
Mating and Board Fit Details
This connector mates with a standard DDR2 SODIMM memory module having a card thickness of 0.039" (1.00mm). The 200-position interface follows the JEDEC DDR2 pinout — the module edge contacts are gold-plated, and the connector's gold flash contacts wipe the module pads on insertion. The 25° angle means the module sits tilted, not vertical, so the board designer must account for the module's overhang length when placing nearby components. Mounting is surface-mount, standard top-side — the connector body sits on the board surface, and the SMT tails solder to pads on the top layer. The normal mounting feature means there is no offset or reverse-mount variant; the connector is designed for a single-sided reflow process. The part ships in a tray — typical for SODIMM connectors, as the SMT tails need protection from handling damage during pick-and-place. Tray packaging also keeps the connector bodies from tangling or bending during transit.
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