Board-to-wire header for harness integration
2.00 mm pitch, right-angle SMD footprint
Pitch is 2.00 mm (0.079 in), a common spacing for wire-to-board headers in compact control modules and sensor interfaces. Solder retention features help hold the part during reflow, reducing tombstoning risk on a mixed-technology board. Insulation height is 0.217 in (5.51 mm), and the mating pin length is 0.139 in (3.53 mm) — enough for a positive latch with the matching HPI receptacle housing.
ROHS3 compliant, with a natural (uncolored) PA9T insulation rated UL94 V-0. The tape-and-reel packaging (Cut Tape also available) supports automated pick-and-place assembly.