SMT solder retention and shrouded 4-wall
The 1775470-5 is the 5-circuit member of TE's High Performance Interconnect (HPI) shrouded header line, designed for board-to-cable/wire applications. It mounts via surface-mount solder termination with integrated solder retention features, and the 4-wall shrouding protects the tin-plated mating contacts during handling and mating.
