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TE Connectivity AMP Connectors 1977276-2 — Pin Headers, Sockets & Housings

TE 1977276-2 AMPMODU 50/50 Grid Header, 30 Pos 1.27mm

MPN1977276-2
Active

TE Connectivity AMPMODU 50/50 Grid header, order code 1977276-2, 30 positions, dual row, 1.27 mm pitch, 30 VAC, gold-plated mating contacts, surface-mount right-angle, solder termination.

$6.8371Ref. price · indicative, final on quote
Source DocumentedChannel stated on listing & quote
Condition PhotosReal unit photos / video on request
WhatsApp AnswersFast human replies for stock & sourcing questions
Worldwide DispatchDHL/FedEx — transit quoted per order
Independent supplier — new & surplus connector stock· Listing updated Aug 2026

Specifications

1977276-2 key specifications
ParameterValue
SeriesAMPMODU 50/50 Grid
TypeMale Pin
MountingSurface Mount, Right Angle
Connector typeHeader
Fastening typePush-Pull
Voltage rating30VAC
Operating temperature-65°C ~ 105°C
Contact materialCopper Alloy
Insulation colorBlack
Insulation height0.213\" (5.40mm)
Insulation materialLiquid Crystal Polymer (LCP)
StyleBoard to Board

All specifications

1977276-2 additional specifications
ParameterValue
PackageTape & Reel (TR) Cut Tape (CT)
FeaturesBoard Lock, Solder Retention
ShroudingShrouded - 4 Wall
TerminationSolder
ApplicationsAutomotive, General Purpose, Medical, Military, Telecommunications
Contact shapeCircular
Rows2
Pitch0.050\" (1.27mm)
Positions30
Row spacing - mating0.050\" (1.27mm)
Contact finish - postTin-Lead
Contact finish - matingGold
Contact finish thickness - post150.0µin (3.81µm)
Contact finish thickness - mating30.0µin (0.76µm)

Product details

30-position board-to-board header, 1.27 mm pitch

The 1977276-2 is the 30-circuit member of TE's AMPMODU 50/50 Grid shrouded header line, designed for board-to-board stacking. It carries gold-plated mating contacts rated 30 VAC and mounts surface-mount right-angle with solder termination.

Pitch and row spacing across the series

The 1.27 mm mating pitch and 1.27 mm row spacing are shared across the AMPMODU 50/50 Grid series — the board footprint stays the same regardless of position count.