The 1MM-HU-D05-VS-00-H-TBP: This 10-position, dual-row header from the AMPMODU 1MM series uses a 1.00 mm pitch and 1.00 mm row spacing — the tightest centreline in the AMPMODU family. At this density, the board footprint is compact enough for mezzanine stacking in portable or space-constrained equipment, but the 1 A per-contact rating limits it to signal-level duty, not power distribution.
Gold plating and temperature range for production and field service
In a production-test fixture or a field-serviceable module where the connector is cycled monthly, that translates to decades of reliable contact resistance.
Surface-mount assembly and pick-and-place compatibility
Termination is solder-only, surface-mount — no through-hole or press-fit option. The header is packaged in a box and includes a pick-and-place feature, meaning it is designed for automated placement and reflow assembly without a separate handling step.