TE Connectivity AMPMODU 1MM series, 1MM-HU-D06-VS-00-F-TBP, board-to-board header, breakaway, 12 positions dual-row, 1.00 mm pitch, gold mating finish, 1 A, UL94 V-0, SMT, unshrouded.
| Parameter | Value |
|---|---|
| Series | AMPMODU 1MM |
| Type | Male Pin |
| Mounting | Surface Mount |
| Connector type | Header, Breakaway |
| Fastening type | Push-Pull |
| Voltage rating | 30VAC |
| Current rating | 1A |
| Operating temperature | -55°C~125°C |
| Contact material | Phosphor Bronze |
| Insulation color | Black |
| Insulation height | 0.059\" (1.50mm) |
| Insulation material | Liquid Crystal Polymer (LCP) |
| Parameter | Value |
|---|---|
| Material flammability rating | UL94 V-0 |
| Style | Board to Board |
| Package | Box |
| Features | Pick and Place |
| Shrouding | Unshrouded |
| Termination | Solder |
| Contact shape | Square |
| Rows | 2 |
| Pitch | 0.039\" (1.00mm) |
| Positions | 12 |
| Row spacing - mating | 0.039\" (1.00mm) |
| Contact finish - post | Tin |
| Contact finish - mating | Gold |
| Contact length - mating | 0.083\" (2.10mm) |
| Contact finish thickness - post | 12.0µin (0.30µm) |
| Contact finish thickness - mating | 3.94µin (0.100µm) |
The mating interface carries a gold finish at 3.94 µinch (0.100 µm) over phosphor bronze contacts.
Surface-mount termination with solder tails — the unshrouded header mates with a matching receptacle for board-to-board stacking. The part is packaged for automated assembly (box format with pick-and-place features), so it flows through standard SMT lines without manual handling.
The mating pitch is 0.039" (1.00 mm), with the same 1.00 mm row spacing between the two rows.
It has 12 positions arranged in two rows, all loaded.
Yes, it is ROHS3 compliant per TE Connectivity's compliance data.
Other AMPMODU 1MM headers with the same 12-position, dual-row, 1.00 mm pitch configuration may be functionally similar, but pin-to-pin compatibility should be verified against the mating receptacle and board footprint.