TE Connectivity AMPMODU 1MM series header, 1MM-HU-D06-VS-00-H-TBP, 12 positions, dual-row, 1.00 mm pitch, unshrouded, male pin, surface-mount, gold mating finish, 30 µinch, 1 A per contact, 30 VAC, -55°C to 125°C, UL94 V-0.
| Parameter | Value |
|---|---|
| Series | AMPMODU 1MM |
| Type | Male Pin |
| Mounting | Surface Mount |
| Connector type | Header, Breakaway |
| Fastening type | Push-Pull |
| Voltage rating | 30VAC |
| Current rating | 1A |
| Operating temperature | -55°C ~ 125°C |
| Contact material | Phosphor Bronze |
| Insulation color | Black |
| Insulation height | 0.059\" (1.50mm) |
| Insulation material | Liquid Crystal Polymer (LCP) |
| Parameter | Value |
|---|---|
| Material flammability rating | UL94 V-0 |
| Style | Board to Board |
| Package | Box |
| Features | Pick and Place |
| Shrouding | Unshrouded |
| Termination | Solder |
| Contact shape | Square |
| Rows | 2 |
| Pitch | 0.039\" (1.00mm) |
| Positions | 12 |
| Row spacing - mating | 0.039\" (1.00mm) |
| Contact finish - post | Tin |
| Contact finish - mating | Gold |
| Contact length - mating | 0.083\" (2.10mm) |
| Contact finish thickness - post | 12.0µin (0.30µm) |
| Contact finish thickness - mating | 30.0µin (0.76µm) |
The 1MM-HU-D06-VS-00-H-TBP: The pins are 0.083" (2.10 mm) long, gold-plated at 30 µinch over nickel on the mating surface, and tin-plated on the solder tails. Surface-mount termination with pick-and-place features supports automated assembly and reflow soldering.
The tin post finish at 12 µinch is standard for solder-joint reliability. The LCP housing maintains dimensional stability across this span.
The pitch is 1.00 mm (0.039") on both the mating and row spacing, and it has 12 positions in a dual-row configuration.
Yes, it is ROHS3 compliant.