Gold on the mating face (3.94 µinch) resists corrosion for occasional mating cycles; the tin-plated solder tails (12.0 µinch) suit standard SMT reflow.
Gold Flash vs. Thicker Gold: Mating Cycle Trade-Off
The -F-TBP suffix carries a 3.94 µinch gold mating finish — a thin flash adequate for low-cycle board-to-board interconnects. The sibling -H-TBP (1MM-HU-D10-VS-00-H-TBP) uses 30.0 µinch gold, rated for significantly more mating cycles. If your application requires repeated disconnect/reconnect in the field, the -H-TBP is the better choice; for one-time assembly or infrequent service, the -F-TBP saves cost.
It is ROHS3 compliant.
