TE Connectivity AMPMODU 1MM series, 1MM-HU-D11-VS-00-H-TBP, board-to-board header, 22 positions, 2 rows, 1.00mm pitch, surface mount, unshrouded, gold mating contact, 1 A, 30 VAC, pick-and-place compatible.
| Parameter | Value |
|---|---|
| Series | AMPMODU 1MM |
| Type | Male Pin |
| Mounting | Surface Mount |
| Connector type | Header, Breakaway |
| Fastening type | Push-Pull |
| Voltage rating | 30VAC |
| Current rating | 1A |
| Operating temperature | -55°C~125°C |
| Contact material | Phosphor Bronze |
| Insulation color | Black |
| Insulation height | 0.059\" (1.50mm) |
| Insulation material | Liquid Crystal Polymer (LCP) |
| Parameter | Value |
|---|---|
| Material flammability rating | UL94 V-0 |
| Style | Board to Board |
| Package | Box |
| Features | Pick and Place |
| Shrouding | Unshrouded |
| Termination | Solder |
| Contact shape | Square |
| Rows | 2 |
| Pitch | 0.039\" (1.00mm) |
| Positions | 22 |
| Row spacing - mating | 0.039\" (1.00mm) |
| Contact finish - post | Tin |
| Contact finish - mating | Gold |
| Contact length - mating | 0.083\" (2.10mm) |
| Contact finish thickness - post | 12.0µin (0.30µm) |
| Contact finish thickness - mating | 30.0µin (0.76µm) |
The solder tails get a 12.0 µinch tin finish for reliable wetting to the PCB pad. A pick-and-place feature (flat top surface) lets the SMT line handle this header without a special nozzle or manual placement step.
The base product number is 1MM-HU-D, so any variant in that family shares the same footprint and mating interface.
Design engineers need full specs for fit and compliance verification before using the part.
Buyers need immediate availability to avoid production delays.
Sourcing buyers must compare costs and fit within BOM budget.
Compliance is mandatory for many regions and applications; missing info can halt procurement.
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Alternate sourcing is critical when primary part is on allocation or NCNR.