Board-to-board header at 1.00mm pitch — 30 positions, SMT
The gold contact finish handles repeated board-to-board mating cycles without fretting corrosion — typical for mezzanine or parallel-board stacking where the connector is disconnected during test or field service. The 1.00mm pitch and unshrouded profile keep the board footprint tight — the insulation height is only 1.50mm above the PCB, which matters when the mated stack height is constrained.
Where this connector fits in the AMPMODU 1MM family
AMPMODU 1MM is TE's fine-pitch board-to-board header series. This unshrouded variant is the lightest in the family — no walls, no locking latches — so it suits low-vibration, low-profile stacking where the mating receptacle provides the alignment. Compare this 30-position SMT part to the through-hole 12-position 1318699-3 from the same family: that part is a 4-row shrouded header with latch lock, rated 5A at 250VAC, on a 4.20mm pitch — a different density and power class entirely. Not a direct cross; different footprint and application.