Pitch, footprint, and routing density
The 1MM-HU-D19-VS-00-F-TBP: The 1.00 mm mating pitch and 1.00 mm row spacing place the 38 positions on a compact footprint; the unshrouded breakaway design allows the header to be snapped to the exact circuit count needed for the board layout.
Male square pins in phosphor bronze: the mating end receives 3.94 µin (0.100 µm) gold over the base metal, while the solder post is tin-plated at 12.0 µin (0.30 µm).
Assembly features
Surface-mount solder termination with pick-and-place features; the push-pull fastening type and unshrouded profile simplify automated placement and manual rework.