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TE Connectivity AMP Connectors 1MM-HU-D25-VS-00-F-TBP — Pin Headers

1MM-HU-D25-VS-00-F-TBP TE Connectivity AMPMODU 1MM Header

MPN1MM-HU-D25-VS-00-F-TBP
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TE Connectivity AMP Connectors AMPMODU 1MM series, 1MM-HU-D25-VS-00-F-TBP, 50-position dual-row unshrouded SMT header, 1.00 mm pitch, gold-plated mating contacts, rated 1 A per circuit at 30 VAC.

$4.4100Ref. price · indicative, final on quote
TE Connectivity AMP Connectors 1MM-HU-D25-VS-00-F-TBP datasheet (PDF)
RoHSROHS3 Compliant
SeriesAMPMODU 1MM
Sourced new & surplus through independent channelsAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

1MM-HU-D25-VS-00-F-TBP key specifications
ParameterValue
SeriesAMPMODU 1MM
TypeMale Pin
MountingSurface Mount
Connector typeHeader, Breakaway
Fastening typePush-Pull
Voltage rating30VAC
Current rating1A
Operating temperature-55°C ~ 125°C
Contact materialPhosphor Bronze
Insulation colorBlack
Insulation height0.059\" (1.50mm)
Insulation materialLiquid Crystal Polymer (LCP)

All specifications

1MM-HU-D25-VS-00-F-TBP additional specifications
ParameterValue
Material flammability ratingUL94 V-0
StyleBoard to Board
PackageBox
FeaturesPick and Place
ShroudingUnshrouded
TerminationSolder
Contact shapeSquare
Rows2
Pitch0.039\" (1.00mm)
Positions50
Row spacing - mating0.039\" (1.00mm)
Contact finish - postTin
Contact finish - matingGold
Contact length - mating0.083\" (2.10mm)
Contact finish thickness - post12.0µin (0.30µm)
Contact finish thickness - mating3.94µin (0.100µm)

Product details

The 1MM-HU-D25-VS-00-F-TBP: At 50 positions in a dual-row layout, the connector occupies roughly 25 mm along the board edge — the pitch drives the routing channel width and via fan-out pattern for the inner rows. The 0.083" (2.10 mm) mating pin length provides enough engagement depth for standard AMPMODU 1MM receptacles.

Tin post finish is standard for solder-joint reliability. The wide temperature window matches the thermal profile of reflow soldering and downstream cabinet ambient.

SMT termination and pick-and-place readiness

Surface mount termination with pick-and-place features enables automated assembly on standard SMT lines. Box packaging supports reel or tray feed depending on the supplier's handling.

Frequently asked questions

What is the pitch of 1MM-HU-D25-VS-00-F-TBP?

The mating pitch is 0.039" (1.00 mm) on both the row and column spacing. This sets the board footprint for the 50-position dual-row layout.

Is 1MM-HU-D25-VS-00-F-TBP surface mount?

Yes, the termination is Solder with Surface Mount mounting type. The header includes pick-and-place features for automated assembly.

What is a suitable replacement for 1MM-HU-D25-VS-00-F-TBP?

No direct pin-compatible replacement is listed. The peer 1318699-3 is a 4-row, 4.20 mm pitch, through-hole power header — a different connector class and footprint. For a functional match, stay within the AMPMODU 1MM series and verify the position count, pitch, and SMT termination.