1.00 mm Pitch, 60-Position Board-to-Board Header
The 1MM-HU-D30-VS-00-F-TBP: This is a 60-position, dual-row board-to-board header from TE Connectivity's AMPMODU 1MM series, designed for high-density parallel board stacking. The push-pull fastening provides a simple friction lock with the mating receptacle — no secondary latch, so the mated pair relies on the housing interference fit for retention.
Gold Mating Finish and 1 A Current Rating
The pick-and-place feature (vacuum pickup area) and box packaging support automated assembly — the header is compatible with standard SMT reflow profiles, and the LCP housing withstands lead-free soldering temperatures without warping. The LCP insulation material maintains dimensional stability across the range, keeping the 1.00 mm pitch registration tight even after thermal cycling.