70-Position, 1.00 mm Pitch Board-to-Board Header
The 1MM-HU-D35-VS-00-H-TBP: The 1.00 mm pitch and 0.039" row spacing set a dense footprint — 35 pins per row, so the overall board keep-out is roughly 35 mm long by 2.5 mm wide, depending on the receptacle width. The tin-plated solder tails (12 µinch) are standard for SMT reflow and mate well with the PCB pad finish.
Termination is surface-mount solder, and the header includes a pick-and-place feature — a flat top surface that the vacuum nozzle can grip during automated assembly. The 0.059" insulation height leaves clearance under the component body for trace routing on the top layer.
No direct pin-compatible replacement is listed by the manufacturer, but the AMPMODU 1MM series includes other position counts (10, 20, 30, 40, 50, 60, 80, 100) with the same 1.00 mm pitch and gold plating — a different position count would require a board layout change.