TE Connectivity AMP Connectors AMPMODU 1MM header, breakaway, order code 1MM-HU-D40-VS-00-F-TBP, 80 positions, dual row, 1.00 mm pitch, 1 A, 30 VAC, gold-plated mating contacts, surface-mount, solder termination.
| Parameter | Value |
|---|---|
| Series | AMPMODU 1MM |
| Type | Male Pin |
| Mounting | Surface Mount |
| Connector type | Header, Breakaway |
| Fastening type | Push-Pull |
| Voltage rating | 30VAC |
| Current rating | 1A |
| Operating temperature | -55°C ~ 125°C |
| Contact material | Phosphor Bronze |
| Insulation color | Black |
| Insulation height | 0.059\" (1.50mm) |
| Insulation material | Liquid Crystal Polymer (LCP) |
| Parameter | Value |
|---|---|
| Material flammability rating | UL94 V-0 |
| Style | Board to Board |
| Package | Box |
| Features | Pick and Place |
| Shrouding | Unshrouded |
| Termination | Solder |
| Contact shape | Square |
| Rows | 2 |
| Pitch | 0.039\" (1.00mm) |
| Positions | 80 |
| Row spacing - mating | 0.039\" (1.00mm) |
| Contact finish - post | Tin |
| Contact finish - mating | Gold |
| Contact length - mating | 0.083\" (2.10mm) |
| Contact finish thickness - post | 12.0µin (0.30µm) |
| Contact finish thickness - mating | 3.94µin (0.100µm) |
The 1MM-HU-D40-VS-00-F-TBP is the 80-position member of TE's AMPMODU 1MM breakaway header line, a dual-row board-to-board unshrouded header at 1.00 mm pitch.
The dual-row layout with 1.00 mm row spacing places 80 circuits in a compact footprint — the row spacing matches the pitch, so the board routing density is uniform across both axes.
Pricing and availability are confirmed at RFQ against the BOM quantity. Submit a request for a current quote and lead time.