TE Connectivity AMPMODU 1MM header, order code 1MM-HU-D47-VS-00-H-TBP, 94 positions, dual row, 1.00 mm pitch, 1 A, 30 VAC, gold-plated mating contacts, surface-mount, unshrouded, solder termination.
| Parameter | Value |
|---|---|
| Series | AMPMODU 1MM |
| Type | Male Pin |
| Mounting | Surface Mount |
| Connector type | Header, Breakaway |
| Fastening type | Push-Pull |
| Voltage rating | 30VAC |
| Current rating | 1A |
| Operating temperature | -55°C ~ 125°C |
| Contact material | Phosphor Bronze |
| Insulation color | Black |
| Insulation height | 0.059\" (1.50mm) |
| Insulation material | Liquid Crystal Polymer (LCP) |
| Parameter | Value |
|---|---|
| Material flammability rating | UL94 V-0 |
| Style | Board to Board |
| Package | Box |
| Features | Pick and Place |
| Shrouding | Unshrouded |
| Termination | Solder |
| Contact shape | Square |
| Rows | 2 |
| Pitch | 0.039\" (1.00mm) |
| Positions | 94 |
| Row spacing - mating | 0.039\" (1.00mm) |
| Contact finish - post | Tin |
| Contact finish - mating | Gold |
| Contact length - mating | 0.083\" (2.10mm) |
| Contact finish thickness - post | 12.0µin (0.30µm) |
| Contact finish thickness - mating | 30.0µin (0.76µm) |
The 1MM-HU-D47-VS-00-H-TBP is the 94-position member of TE's AMPMODU 1MM header line, a dual-row unshrouded breakaway style for board-to-board stacking. Gold-plated mating contacts rated 1 A at 30 VAC, surface-mount solder termination, and a 1.00 mm pitch that matches the row spacing for a dense footprint.