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TE Connectivity AMP Connectors 1MM-HU-D50-VS-00-F-TBP — Pin Headers, Sockets & Housings

1MM-HU-D50-VS-00-F-TBP AMPMODU 1MM Header 100 Pos 1mm Pitch

MPN1MM-HU-D50-VS-00-F-TBP
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TE Connectivity AMPMODU 1MM series, 1MM-HU-D50-VS-00-F-TBP, unshrouded breakaway header, 100 positions, 2 rows, 1.00 mm pitch, surface mount solder termination, gold mating finish, tin post finish, rated 1 A, 30 VAC, -55°C to 125°C, UL94 V-0.

$9.0631Ref. price · indicative, final on quote
Source DocumentedChannel stated on listing & quote
Condition PhotosReal unit photos / video on request
WhatsApp AnswersFast human replies for stock & sourcing questions
Worldwide DispatchDHL/FedEx — transit quoted per order
Independent supplier — new & surplus connector stock· Listing updated Aug 2026

Specifications

1MM-HU-D50-VS-00-F-TBP key specifications
ParameterValue
SeriesAMPMODU 1MM
TypeMale Pin
MountingSurface Mount
Connector typeHeader, Breakaway
Fastening typePush-Pull
Voltage rating30VAC
Current rating1A
Operating temperature-55°C~125°C
Contact materialPhosphor Bronze
Insulation colorBlack
Insulation height0.059\" (1.50mm)
Insulation materialLiquid Crystal Polymer (LCP)

All specifications

1MM-HU-D50-VS-00-F-TBP additional specifications
ParameterValue
Material flammability ratingUL94 V-0
StyleBoard to Board
PackageBox
FeaturesPick and Place
ShroudingUnshrouded
TerminationSolder
Contact shapeSquare
Rows2
Pitch0.039\" (1.00mm)
Positions100
Row spacing - mating0.039\" (1.00mm)
Contact finish - postTin
Contact finish - matingGold
Contact length - mating0.083\" (2.10mm)
Contact finish thickness - post12.0µin (0.30µm)
Contact finish thickness - mating3.94µin (0.100µm)

Product details

Board-fit reality for a 100-position 1.00 mm pitch header

The 1MM-HU-D50-VS-00-F-TBP: This is an unshrouded breakaway header from the AMPMODU 1MM series, 100 positions in two rows at 1.00 mm pitch — the tightest pitch in the series. Surface mount termination with a pick-and-place feature (the 'F' suffix in the order code) means it feeds through a standard SMT line.

Parametric deep-dive: pitch, positions, and plating

The 1.00 mm mating pitch and 1.00 mm row spacing create a dense grid — 100 signals in a footprint roughly 0.039" × 0.039" per position before the solder tails.