Board-to-Board SMT Receptacle for Dense Stacking
The 1MM-R-D10-VS-00-H-TBP: This is a 20-position, dual-row, 1.00 mm pitch board-to-board receptacle from the AMPMODU 1MM series. The tin post finish handles the solder joint fine.
Sizing the Stack Height and Routing Density
The 1.00 mm pitch and 0.039" row spacing set a tight board footprint — the 20 positions in two rows keep the connector width under 5 mm. This is a space-saver compared to a 2.54 mm pitch alternative like the 1-2823056-2 (12 positions, 0.100" pitch, tin mating), but the 1 A current ceiling means it's a signal-only interconnect. The 30 µinch gold on the mating contacts is a step up from the 8 µinch gold on the 1376775-2 and 1376775-3 (5 and 3 positions, 3 A, 250 VAC) — those are lower-cycle, higher-current parts in a different form factor. This one is built for repeated mating in a dense board stack.