Board-to-Board Receptacle for Dense Parallel Stacking
The 1MM-R-D15-VS-00-F-TBP: Surface-mount termination and a push-pull fastening type suit automated assembly, with pick-and-place features noted in the package. The gold mating finish at 5.00 µinch thickness provides corrosion resistance for infrequent mating cycles; for applications requiring repeated disconnect, a thicker gold option in the same series would extend contact life.
Footprint and Stack-Height Constraints
With a 0.118" (3.00 mm) insulation height, the mated stack height depends on the mating header's profile — typical AMPMODU 1MM headers add 3–5 mm, keeping the total within a 6–8 mm z-height budget. The 1.00 mm pitch and 0.039" row spacing demand tight trace routing on the PCB; a 4-layer board is recommended for fan-out on all 30 positions.