50-Position, 1.00 mm Pitch Board-to-Board Receptacle
Its 1.00 mm mating pitch and 0.039" row spacing set a tight footprint that suits dense PCB layouts where signal routing space is at a premium. Surface-mount termination and a pick-and-place compatible Box package support automated assembly, reducing manual handling in high-volume production.
No official second-source or pin-compatible alternative is recorded in the AMPMODU 1MM series — the 1MM-R-D25-VS-00-F-TBP is the specific 50-position dual-row SMT receptacle for this footprint.
This receptacle mates with a matching AMPMODU 1MM board-to-board header (not included). The push-pull interface means no secondary lock; the connection is held by the contact normal force and the alignment of the two boards. Termination is solder to surface-mount pads — no press-fit or crimp option. The black thermoplastic housing stands 0.118" (3.00 mm) above the board, which sets the stack height when mated with a header of complementary height.