TE Connectivity Micro MATE-N-LOK header, 3 circuits, single row, 0.118" (3.00 mm) pitch, shrouded 4-wall, male pin, through-hole press-fit/solder termination, gold mating contacts, locking ramp, UL94 V-0, -40°C to 105°C.
| Parameter | Value |
|---|---|
| Series | Micro MATE-N-LOK |
| Type | Male Pin |
| Mounting | Through Hole |
| Connector type | Header |
| Fastening type | Locking Ramp |
| Voltage rating | 250V |
| Current rating | Varies by Wire Gauge |
| Operating temperature | -40°C ~ 105°C |
| Contact material | Brass |
| Insulation color | Black |
| Insulation height | 0.364\" (9.25mm) |
| Insulation material | Polyamide (PA), Nylon |
| Parameter | Value |
|---|---|
| Material flammability rating | UL94 V-0 |
| Style | Board to Cable/Wire |
| Package | Tray |
| Features | Board Guide |
| Shrouding | Shrouded - 4 Wall |
| Termination | Press-Fit, Solder |
| Applications | General Purpose |
| Contact shape | Square |
| Rows | 1 |
| Pitch | 0.118\" (3.00mm) |
| Positions | 3 |
| Contact finish - post | Tin |
| Contact length - post | 0.125\" (3.18mm) |
| Contact finish - mating | Gold |
| Contact finish thickness - post | 100.0µin (2.54µm) |
| Contact finish thickness - mating | 15.0µin (0.38µm) |
The 2-1445084-3: This is a 3-circuit, single-row header from TE's Micro MATE-N-LOK series, on 3.00 mm pitch — the footprint dimension that decides board routing density and the matching receptacle's contact spacing.
The header accepts both press-fit and solder terminations — press-fit for a solderless backplane assembly, solder for a conventional through-hole joint on a standard PCB.
Yes — the style is Board to Cable/Wire. It mates with a Micro MATE-N-LOK receptacle housing that accepts crimp terminals on discrete wires.