Board-to-wire header for 3.00mm pitch harnesses
The gold-plated mating contacts (15.0µin) and tin-plated solder posts (100.0µin) balance corrosion resistance during repeated mating with reliable solder joint formation.

TE Connectivity AMP Connectors Micro MATE-N-LOK, Header, Male Pin, Solder, Surface Mount, 6 Positions, 3.00mm Pitch, Shrouded - 4 Wall, Locking Ramp, Gold Mating Finish, -40°C ~ 105°C, UL94 V-0
| Parameter | Value |
|---|---|
| Series | Micro MATE-N-LOK |
| Type | Male Pin |
| Mounting | Surface Mount |
| Connector type | Header |
| Fastening type | Locking Ramp |
| Voltage rating | 250V |
| Current rating | Varies by Wire Gauge |
| Operating temperature | -40°C ~ 105°C |
| Contact material | Brass |
| Insulation color | Black |
| Insulation height | 0.364\" (9.25mm) |
| Insulation material | Polyamide (PA), Nylon |
| Parameter | Value |
|---|---|
| Material flammability rating | UL94 V-0 |
| Style | Board to Cable/Wire |
| Package | Tape & Reel (TR) Cut Tape (CT) |
| Features | Pick and Place, Solder Retention |
| Shrouding | Shrouded - 4 Wall |
| Termination | Solder |
| Applications | General Purpose |
| Contact shape | Square |
| Rows | 1 |
| Pitch | 0.118\" (3.00mm) |
| Positions | 6 |
| Contact finish - post | Tin |
| Contact finish - mating | Gold |
| Contact finish thickness - post | 100.0µin (2.54µm) |
| Contact finish thickness - mating | 15.0µin (0.38µm) |
The gold-plated mating contacts (15.0µin) and tin-plated solder posts (100.0µin) balance corrosion resistance during repeated mating with reliable solder joint formation.
This header mates with a Micro MATE-N-LOK receptacle housing (crimp or IDC type) of the same 6-position, 3.00mm pitch configuration. Confirm the specific receptacle part number from the series for your wire gauge and termination preference.
The pitch is 3.00mm (0.118") and it has 6 positions in a single row, all loaded.