8-Pin DIP Socket with 0.3-Inch Row Spacing
The 2-1571551-2: This is a 8-position DIP socket arranged in a 2 x 4 grid with 0.100" (2.54mm) pitch between pins and 0.3" (7.62mm) between rows — the standard footprint for 8-pin DIP ICs and many small-outline packages adapted for through-hole prototyping.
Obsolete — Sourced Through Independent Distribution
Available through independent surplus and authorized aftermarket channels. No pin-compatible direct replacement is listed by the manufacturer. A board-spin or a functional alternative from the same series may be needed — verify the footprint and mating requirements before committing to a substitute.
Contact Materials and Plating for Signal Integrity
Mating contacts are beryllium copper with gold flash — beryllium copper provides high yield strength and good spring properties for repeated IC insertions, while the gold flash prevents oxidation at the contact interface. Post contacts are nickel with gold flash, and the contact resistance is rated at 10 mOhm, ensuring a low-resistance path from the IC leg to the PCB trace.