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TE Connectivity AMP Connectors 2-2013289-1 — Pin Headers, Sockets & Housings

2-2013289-1 TE Connectivity SODIMM Socket, 204-Pos, SMD

MPN2-2013289-1
Active

TE Connectivity AMP Connectors SODIMM socket, 204 positions, DDR3 SDRAM, surface mount 25° angle, gold flash contacts, board guide and latches.

$5.0428Ref. price · indicative, final on quote
RoHSROHS3 Compliant
Sourced new & surplus through independent channelsAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

2-2013289-1 specifications
ParameterValue
Memory typeDDR3 SDRAM
MountingSurface Mount, 25° Angle
Mounting featureNormal, Standard - Top
Connector typeSODIMM
PackageTape & Reel (TR); Cut Tape (CT)
FeaturesBoard Guide, Latches
Contact finishGold
Positions204
Contact finish thicknessFlash

Product details

204-Position SODIMM Socket for DDR3 Memory Modules

The 2-2013289-1: This TE Connectivity SODIMM socket is a 204-position, surface-mount connector designed for DDR3 SDRAM memory modules. The 25° angle orientation sets the module insertion angle and the board footprint, which is a standard for SODIMM connectors in notebook and embedded systems. Integrated board guide aids module alignment during insertion, and the latches provide positive retention against vibration-induced disconnect in portable or industrial equipment.

DDR3 Compatibility and Memory Type

The socket is explicitly rated for DDR3 SDRAM memory type, confirming electrical and mechanical compatibility with standard DDR3 SO-DIMM modules. This is the primary BOM-fit check for memory upgrades or new designs targeting DDR3.

Available in Tape & Reel (TR) for automated assembly and Cut Tape (CT) for prototype or low-volume builds.

Frequently asked questions

Is 2-2013289-1 compatible with DDR3 memory modules?

Yes, this socket is explicitly rated for DDR3 SDRAM memory type, confirming compatibility with standard DDR3 SO-DIMM modules.

What is the mounting orientation of 2-2013289-1?

The socket is surface mount with a 25° angle, which sets the module insertion angle and the board footprint for standard SODIMM applications.