204-Position DDR3 SODIMM Socket — Mechanical Fit and Memory Compatibility
The 2-2013290-1: This is a 204-position DDR3 SDRAM SODIMM socket from TE Connectivity, designed for surface-mount assembly at a 25° angle with reverse mount orientation. The 204-position count matches the JEDEC standard for DDR3 SO-DIMM modules — not the 200-position DDR2 or the 260-position DDR4. Gold flash contact finish provides adequate corrosion resistance and mating cycle life for standard DDR3 insertion rates — typically rated for 100–200 cycles. For applications requiring frequent module swaps (test fixtures, field-upgradeable systems), a thicker gold plating (15 µinch or greater) would be more appropriate. Integrated board guide aligns the memory module during insertion, and the latches lock it in place to prevent dislodging under vibration. These features are standard on SODIMM sockets but not universal — confirm their presence if your design relies on them for retention.
Mounting and Orientation — Board-Level Integration
Surface-mount termination at a 25° angle means the module sits at a shallow angle relative to the PCB — this is typical for DDR3 SODIMM sockets and sets the z-height clearance needed above the board. CT suits prototype or low-volume builds.
The base product number is 2013290, which covers the series; the suffix -1 denotes this specific configuration (204-position, reverse, 25° angle).