20-Position DIP Header for IDC Ribbon Cable
The TE Connectivity AMP-Latch 2-216791-0 is a 20-position DIP header designed for mass-termination IDC ribbon cable. It mates with the matching AMP-Latch socket connector to form a reliable board-to-cable interconnect. This is a through-hole, press-fit header — the compliant press-fit tail deforms into the plated through-hole without solder, which makes it suitable for backplane or high-reliability assemblies where solderless termination is preferred for rework or thermal management. All 20 positions are loaded, so there is no need to check for optional empty positions. The feed-through feature allows the ribbon cable to pass through the header body, enabling daisy-chain connections to multiple boards without a separate jumper.
Tin Contacts at 118.1 µin — What That Means for Duty
For high-cycle or corrosive-environment duty, a gold-plated variant of the AMP-Latch series would be the appropriate choice. This tin-plated version is best matched to consumer electronics, office equipment, or telecom line cards where the cable is terminated once during manufacturing.
Press-Fit Termination — Solderless Assembly
The compliant section of the tail compresses as it enters the hole, creating a gas-tight joint without the thermal stress of wave or reflow soldering. This is a common requirement for backplane connectors where the PCB assembly goes through multiple reflow passes or where field rework of individual pins is needed. Verify the PCB footprint against the product drawing before layout — the press-fit force can damage the board if the hole size is out of tolerance.
The 2-216791-1 is a different variant within the same base product family — confirm the specific position count and plating before substituting.