It belongs to the 2170747 series of high-speed I/O interconnect components designed for faceplate-mount applications in switches, routers, and data-center equipment. The ZQSFP+ form factor is the physical-layer interface for QSFP28 modules carrying 100 GbE (4x25 Gbps) lanes, and this cage accepts both active and passive QSFP28 transceivers and direct-attach copper cables. The integrated heat sink provides thermal management for the module without requiring a separate board-level heatsink; the light pipe routes the module's link-status LED to the faceplate, eliminating a discrete indicator PCB.
Termination and Mounting — Press-Fit, Right-Angle
The mounting type is through-hole, so the cage's alignment posts and press-fit pins engage the PCB before any module is inserted.
EMI Shielding and Light Pipe — What's Built In
The cage carries integrated EMI shielding — a gasket or spring-finger array at the faceplate interface that bonds the cage ground to the panel, containing radiated emissions from the serial lanes.