The 2-2314814-0: This is a 20-position, dual-row board-to-board receptacle from the TE AMPMODU series. The 2 A ceiling is typical for signal-level interconnects at this pitch; the wide temperature window covers industrial cabinet and under-hood environments.
Gold-on-gold mating interface (30.0 µinch gold on the receptacle side) avoids the fretting corrosion that tin contacts can develop under vibration or thermal cycling. The post finish is tin with 12.0 µinch thickness — adequate for solder-joint reliability through wave or hand-solder processes.