Board-to-Board Stacking with 2.00mm Pitch
The 2-2314826-0: The 0.079" row spacing mirrors the pitch, giving a dense but routable footprint for mid-density interconnects. This suits equipment inside enclosures where flame retardance and thermal cycling are specified, such as industrial controls or telecom line cards.
Through-Hole Termination and Pick-and-Place Ready
The connector is shipped in tube packaging and includes pick-and-place features for automated assembly.
ROHS3 compliant. The housing material and contact plating meet the directive's substance restrictions for electronic equipment placed on the EU market.
