20-Position Unshrouded Header at 5.00mm Pitch
The 2-282832-1: This is a 20-position, single-level unshrouded header from TE's Buchanan series, built for through-hole soldering onto a PCB.
Side Stacking for Multi-Header Arrays
A side-stacking feature lets you place multiple headers edge-to-edge on the same pitch grid, creating a wider pin field without gaps. On a 5.00mm pitch board, stacking two of these gives a 40-position continuous row — useful when a single wide header isn't available or you need modular layout flexibility.
TE Connectivity has marked this part obsolete. No official replacement or pin-compatible successor is recorded. If you need a drop-in, the board footprint and 5.00mm pitch are the constraints; any alternative must match the 20 positions, unshrouded vertical orientation, and through-hole solder tails.