68-Position Shielded D-Sub Cap for High-Density Signal I/O
The TE Connectivity AMPLIMITE.050 II 2-5174225-5 is a 68-position D-sub cap with male pins, designed for high-density signal interconnect in applications where board space is tight and EMI containment matters. It sits in the AMPLIMITE.050 II series, which uses a 0.050" pitch and 0.100" row-to-row spacing to pack 68 contacts into a shell size roughly equivalent to a standard DA-15 footprint.
Shielding and Mechanical Retention in a Vibration Environment
The zinc shell with nickel plating provides a continuous EMI barrier around the 68 signal contacts — critical when the connector sits near switching power supplies or RF stages. The M2.5 threaded flange and latchblocks on the housing give mechanical retention beyond the friction of the pins alone; in a high-vibration cabinet or mobile equipment, the flange bolts to the mating receptacle's threaded inserts to keep the pair mated. The 0.149" (3.80 mm) backset spacing leaves clearance behind the connector for PCB components, so the board layout can route traces under the shell without interference.
1 A Signal-Duty Contacts with 30 µ" Gold Plating
Each phosphor bronze contact is rated 1 A — a per-pin limit that confirms this is a signal-density connector, not a power interconnect. The 100 V rating is typical for signal-level D-subs; if the application carries higher potentials, the 0.050" pitch limits creepage distance between adjacent pins.
Wide-Temperature Dielectric and ROHS3 Compliance
PBT resists moisture absorption and maintains dimensional stability through solder reflow.