High-Density D-Sub for Signal-Dense Boards
The TE Connectivity AMPLIMITE.050 II 2-5174339-5 is a 68-position D-sub cap (male pin side) designed for high-density signal interconnects where board space is tight. It uses a 0.050 inch pitch with 0.100 inch row-to-row spacing, packing 68 circuits into a shell size notably smaller than a standard-density 50-position D-sub. The through-hole solder termination and dual-row layout fit a compact board footprint, and the shielded zinc shell with nickel plating keeps EMI from leaking into or out of the cable assembly.
Signal Duty, Not Power — What the 1 A Rating Means
Shielded Shell and Temperature Range
The zinc shell with nickel plating provides RFI/EMI shielding, and the housing/shell flange includes M2.5 threaded inserts for secure panel mounting.
