TE 2-640500-2, 6-Pin MR Header, 4.20mm, 6A
TE Connectivity 2-640500-2, MR series 6-position dual-row shrouded male header, 0.165" (4.20mm) pitch, through-hole solder termination, gold mating contacts 30.0µin (0.76µm), tin post plating 150.0µin (3.81µm), 6A 250VAC, latch lock, operating -55°C to 105°C, UL94 V-0 polyamide housing, bulk package.
Specifications
| Parameter | Value |
|---|---|
| Series | MR (Miniature Rectangular) |
| Type | Male Pin |
| Mounting | Through Hole |
| Connector type | Header |
| Fastening type | Latch Lock |
| Voltage rating | 250VAC |
| Current rating | 6A |
| Operating temperature | -55°C ~ 105°C |
| Contact material | Phosphor Bronze |
| Insulation color | Black, Red |
| Insulation height | 0.531\" (13.50mm) |
| Insulation material | Polyamide (PA), Nylon |
All specifications
| Parameter | Value |
|---|---|
| Material flammability rating | UL94 V-0 |
| Style | Board to Cable/Wire |
| Package | Bulk |
| Shrouding | Shrouded - 4 Wall |
| Termination | Solder |
| Applications | General Purpose |
| Contact shape | Circular |
| Rows | 2 |
| Pitch | 0.165\" (4.20mm) |
| Positions | 6 |
| Row spacing - mating | 0.165\" (4.20mm) |
| Contact finish - post | Tin |
| Contact length - post | 0.150\" (3.81mm) |
| Contact finish - mating | Gold |
| Contact length - mating | 0.220\" (5.59mm) |
| Contact finish thickness - post | 150.0µin (3.81µm) |
| Contact finish thickness - mating | 30.0µin (0.76µm) |
Frequently asked questions
What series does the 2-640500-2 belong to?
It is a member of the TE Connectivity MR (Miniature Rectangular) series, a dual-row 0.165-inch (4.20 mm) pitch header family used in board-to-cable and board-to-board general-purpose interconnects.
What is the 2-640500-2's listed style?
The style is Board to Cable/Wire — the header is oriented for cable-side termination in a wire-to-board harness, not as a board-to-board mezzanine plug.
What contact plating does the 2-640500-2 carry, and where?
The mating face is gold-plated at 30.0 µin (0.76 µm) over nickel; the solder posts are tin-plated at 150.0 µin (3.81 µm). The gold thickness is consistent with a durable mating interface rather than a flash deposit.