60-Position DIP Header for Ribbon Cable
The TE Connectivity AMP-Latch 2-746610-4 is a 60-position DIP header designed for mass-termination of ribbon cable via IDC (Insulation Displacement Contact). It sits in the AMP-Latch series, a long-running family of IDC connectors for parallel cable-to-board interconnects. Termination is IDC, accepting 26-28 AWG stranded or 26-30 AWG solid wire. The through-hole mounting keeps the header perpendicular to the board, suited for vertical cable exits in card-edge or backplane assemblies. The black housing includes a feed-through feature, allowing daisy-chaining along the cable.
Contact Finish and Duty
Contacts are tin-plated with a thickness of 100.0 µ" (2.54 µm).
Board Layout: Pitch and Footprint
The cable-side pitch is 0.050" (1.27 mm), which means the ribbon cable's conductors are half the spacing of the board pads — the header's internal trace fan-out handles the transition. No extra routing density required on the PCB; the 2.54 mm pitch keeps trace escape manageable even on two-layer boards.