Impact 90-Position Header for High-Density Backplanes
The TE Impact 2007777-1 is a 90-position header, male pins, in the Impact connector style — the high-density backplane interface that routes differential pairs at 25+ Gb/s. This is the straight through-hole, press-fit version, designed for the midplane side of a backplane pair. The 0.075" (1.91mm) pitch packs 90 circuits into a 9-row by 10-column grid, with every position loaded. Rated 0.75A per contact at 30VAC/DC, this is a signal-only path; the 9-row density limits per-contact current before the contact itself does.
This header mates exclusively with the Impact right-angle receptacle — the female counterpart that mounts on the daughtercard. The press-fit termination cold-forms into the plated through-hole of the backplane, creating a gas-tight joint without solder. The compliant pin design absorbs board thickness variation and supports multiple insertion cycles if a card slot is depopulated or reworked. No crimp, no solder iron — the assembly tool presses the header into the backplane with a controlled force profile.
The 90-position Impact header is a standard catalog item, so lead times are typically manageable, but the press-fit variant has a narrower supply base than the solder-tail version. Confirm the BOM line quantity and the mating receptacle order code before committing.