Backplane Header for High-Density Signal Routing
The TE Connectivity 2007791-1 is a 90-position Impact series backplane header, male pins, arranged in 9 rows by 10 columns. It carries a 60-signal, 30-ground contact layout — the ground density is deliberate, controlling crosstalk in high-speed differential pair routing. The 0.075" (1.90mm) pitch is tight for a backplane header, which means the board footprint forces a higher layer count to route all signals out. This is a signal-level interconnect, rated 0.75A per contact, not a power header — don't mistake the 90 positions for current capacity.
Press-Fit Termination, No Solder
Termination is press-fit through-hole. That means the compliant pin cold-deforms into the plated through-hole — no solder joint, no reflow profile to manage. This is standard for backplane assembly where rework matters: you can pull a damaged header and seat a replacement without desoldering 90 joints. The trade-off is that the PCB hole size and plating thickness must match the press-fit pin spec exactly, or the retention force drops off.
Gold Plating and Mating Cycles
That thickness supports repeated daughtercard insertions — typical backplane service life of 200+ cycles without exposing base metal.
Lifecycle status is Active per the manufacturer. No last-time-buy notice, no phase-out. ROHS3 compliant. No stock-holding claim from this desk.