Impact Backplane Header — 120-Position Press-Fit for High-Density Routing
It uses a 12-row by 10-column grid on a 0.075" (1.91mm) pitch — a tight enough pitch to route dense differential pairs but wide enough to keep PCB via escape manageable with standard layer counts. Rated 0.75A per contact at 30VAC/DC, this is a signal-density connector for logic-level paths, not a power bus.
Press-Fit Termination and Board Layout Fit
The press-fit compliant pin is the key feature for a backplane build. It mates into a plated through-hole without solder — the pin's compliant section deforms elastically to create a gas-tight joint. This means the board can be assembled without a wave or selective solder step, and individual pins can be replaced if damaged. The 0.075" (1.91mm) pitch drives the PCB footprint: the 12-row × 10-column grid requires a specific hole pattern in the backplane, and the press-fit hole size must match the pin's recommended PCB footprint. The header is keyed with a "Guide Left" feature — this orientation must match the mating receptacle's guide pin to avoid a mis-mate during card insertion.