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TE Connectivity AMP Connectors 2041549-1 — IC & Device Sockets

TE Connectivity 2041549-1 DMD PGA ZIF Socket, 350-Position

MPN2041549-1
Active

TE Connectivity DMD series, 2041549-1, 350-position (35×36) PGA ZIF socket, 0.050" (1.27 mm) pitch, surface mount, 500 mA, flash gold mating contacts, tin-lead post finish, UL94 V-0 LCP housing, Closed Frame.

$5.4022Ref. price · indicative, final on quote
RoHSRoHS Compliant
SeriesDMD
Sourced new & surplus through independent channelsAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

2041549-1 specifications
ParameterValue
TypePGA, ZIF (ZIP)
SeriesDMD
MountingSurface Mount
Current rating500 mA
Operating temperature-55°C~105°C
Housing materialLiquid Crystal Polymer (LCP), Glass Filled
Contact material - postCopper Alloy
Contact material - matingCopper Alloy
Material flammability ratingUL94 V-0
PackageTape & Reel (TR); Cut Tape (CT)
FeaturesClosed Frame
TerminationSolder
Pitch - post0.050\" (1.27mm)
Pitch0.050\" (1.27mm)
Contact finish - postTin-Lead
Contact finish - matingGold
Contact finish thickness - matingFlash
Number of positions or pins350 (35 x 36)

Product details

PGA ZIF Socket for High-Pin-Count ICs

The TE Connectivity 2041549-1 is a 350-position (35×36) PGA ZIF (zero insertion force) socket from the DMD series, designed to accept high-pin-count PGA devices without damaging their delicate pins during insertion or removal. The ZIF mechanism — actuated by a lever or cam — opens the contacts wide enough for the PGA device to drop in freely, then closes to grip each pin with a wiping action that cleans the interface. Rated at 500 mA per circuit, this socket is suited for signal-level duty — logic lines, address/data buses, and GPIO — not for power pins carrying more than half an amp.

The Closed Frame design means the socket body fully surrounds the contact area, providing mechanical support and preventing debris ingress during handling. Termination is surface-mount, with tin-lead finish on the post side. The SMT footprint requires a reflow profile compatible with the LCP housing's heat deflection — the solder joints are on the board side, while the ZIF mechanism and mating contacts remain above the board surface.

The base product number is 2041549, so any future variant or packaging option will share that root. The DMD series includes other position counts, but a 350-position (35×36) grid is specific to this variant.

Frequently asked questions

Where can I buy the 2041549-1 and what is the lead time?

Contact the storefront with your BOM quantity for a same-day quote.

How many positions does the 2041549-1 have?

The 2041549-1 is a 350-position socket arranged in a 35×36 grid, matching standard PGA device pinouts.

Is the 2041549-1 RoHS compliant?

Yes, the 2041549-1 is listed as RoHS Compliant by TE Connectivity.